0.3
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The PCB Trace Width Calculator determines the minimum copper trace width required to safely carry a given current on a printed circuit board without excessive heating. When you design your own PCBs for maker projects — whether using KiCad, EasyEDA, or Fritzing — getting trace width right is essential for both safety and reliability. Too narrow a trace overheats and can delaminate or burn. Too wide wastes precious board space and raises fabrication cost.
PCB copper traces are thin conductors with real resistance, and current flowing through resistance generates heat (P = I²R). At low currents (below 500mA), standard 0.25mm (10 mil) signal traces are more than adequate and are routinely used for Arduino GPIO, SPI, I2C, and UART connections. At higher currents — motor drivers, power rails, battery charging circuits, LED power lines — trace width must be specifically calculated.
This calculator implements the IPC-2221 standard formula, which is the industry-accepted method for trace width calculation used by professional PCB engineers. The formula relates current (I), temperature rise (ΔT), and cross-sectional area (A): I = k × ΔT^b × A^c, where k, b, and c are empirical constants that differ for external (outer layer) and internal traces. External traces benefit from natural convection and radiation cooling; internal traces are sandwiched between substrate layers with reduced thermal dissipation, requiring wider traces for the same current.
Copper thickness is specified in oz/ft² — a weight per area measurement that correlates to physical thickness. Standard PCB copper is 1 oz/ft², corresponding to approximately 35 µm (1.378 mil) thickness. 2 oz copper is 70 µm thick and can carry roughly 40% more current at the same width. Most budget PCB manufacturers (JLCPCB, PCBWay, OSHPark) offer 1 oz copper as standard. 2 oz copper is available as an upgrade and is recommended for power electronics.
Temperature rise is the permissible increase in trace temperature above ambient. IPC-2221 defines two common values: 10°C rise is conservative and recommended for general use — your board stays cool and component lifetimes are maximized. 20°C rise allows narrower traces but the board runs noticeably warm. For outdoor or high-reliability applications, stick to 10°C. For compact boards where space is premium, 20°C is acceptable. Never design for more than 30–40°C rise in commercial products.
For hobby projects, practical minimum trace widths to remember: signal traces (logic, SPI, I2C, UART) — 0.2–0.25mm (8–10 mil) is the PCB fab minimum for most services; power traces at 1A — use 0.5mm (20 mil) with 1 oz copper; power traces at 2A — use 1mm (40 mil); power traces at 5A — use 2.5mm (100 mil); ground planes — use fills/pours rather than traces. Always add 25–50% extra width beyond the calculated minimum for real-world margin.
Trace resistance is also provided because it affects voltage drop in power rails. A long, narrow 5V power trace serving multiple components can drop significant voltage, causing the far end of the board to receive less than 5V. For a 10cm trace at 1A, knowing the resistance lets you calculate the voltage drop (V = IR) and assess whether it impacts circuit operation. For sensitive analog circuits, minimize trace resistance in reference voltage paths.
The IPC-2221 empirical formula is: I = k × ΔT^0.44 × A^0.725, where I is current in amperes, ΔT is temperature rise in °C, A is cross-sectional area in square mils, k = 0.048 for external traces and k = 0.024 for internal traces. Rearranging for area: A = (I / (k × ΔT^0.44))^(1/0.725). Width in mils = A / thickness_in_mils. Resistance per unit length uses copper resistivity ρ = 1.724×10⁻⁸ Ω·m: R = ρ × L / (width × thickness).
The result is the minimum width — always use at least this width for power traces. Add 25–50% safety margin for real boards. For critical applications (motor drivers, battery circuits), double the calculated width. Use copper pours (filled areas) for ground and high-current power planes instead of traces. Verify that your PCB fabricator's minimum trace width (usually 0.1–0.15mm for quality fabs) is not the limiting constraint for signal traces.
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Results
1A at 10°C rise on 1 oz external copper requires ~0.46mm (18 mil) trace. Use 0.5mm for clean standard value. Resistance is only 13.9mΩ per 10cm — negligible voltage drop.
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Results
5A motor current at 20°C rise with 2 oz copper needs ~1.46mm trace. Use 1.5mm and keep traces short. Consider copper pours for very high-current paths.
External (outer layer) traces are exposed to air and can dissipate heat by convection and radiation. Internal traces are embedded in the PCB substrate, which is thermally insulating (FR4 has poor thermal conductivity). Internal traces must be wider by roughly √2 (about 40% wider) to carry the same current at the same temperature rise. The IPC-2221 formula uses k=0.048 for external and k=0.024 for internal to account for this difference.
Always use copper pours (filled polygons) for ground planes on PCBs, not traces. A ground pour covers the entire unused board area on a layer, minimizing ground resistance, reducing EMI, and improving heat dissipation. In KiCad, add a fill zone assigned to the GND net. This is standard practice for all PCB designs beyond simple single-sided boards.
In PCB design, "mil" (short for milli-inch) equals one thousandth of an inch, or 0.0254mm. Do not confuse with millimeter (mm) or milliliter. Most older PCB tools and US datasheets use mils; newer tools and European standards use mm. Conversion: 1 mil = 0.0254mm, 1mm ≈ 39.4 mil. Common trace widths: 6 mil (0.15mm) minimum for most fabs, 10 mil (0.254mm) standard signal, 40 mil (1mm) heavy power.
Trace current capacity is primarily determined by cross-section (width × thickness), not length. However, longer traces have higher resistance, causing more voltage drop (V = I × R) and more total heat generation (P = I² × R × length). For long power traces, increase width to keep voltage drop acceptable, not just to meet thermal requirements. A general guideline: keep voltage drop under 0.1V for 5V logic power rails.
KiCad (free, open-source, professional-grade) is the most popular choice for serious makers — excellent Gerber export, active community, large component library. EasyEDA (browser-based, free, integrated with JLCPCB ordering) is great for beginners. Fritzing is designed for Arduino-style visual prototyping but has limited professional features. Eagle (now Autodesk Fusion 360) has a free hobbyist tier. For custom PCB fabrication, JLCPCB and PCBWay offer 2-layer boards for $2–5 for small quantities.
Component pads (solder pads for through-hole or SMD components) often constrain trace width — a 0805 SMD pad may only be 1.6mm wide. Use thermal relief connections for through-hole components in copper pours. For high-current SMD components (MOSFETs, motor driver ICs), add multiple vias to distribute current to internal copper layers, or use wider pads if the package allows. Check that pad-to-trace transitions don't create narrow choke points.
Roboculator Team
The Roboculator Team explains calculations, planning tools, and practical formulas in clear language for real-life situations.
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